Thin-film panels designed for long-term outdoor deployment.
Encapsulated construction: Moisture and debris resistant.
Stable output profile: Designed for continuous exposure environments.
Low-maintenance architecture: No moving parts.
Thin-film solar panels engineered for embedded electronics and low-power devices. Custom form factors and voltage configurations available.
Provide an overview of your application, operating environment, and power requirements. Our engineering team will review your inputs and follow up with next steps.
Purpose-built thin-film panels for direct integration into embedded electronic assemblies. Available in defined stock series or engineered as custom designs to meet specific electrical, mechanical, and environmental requirements.
Supports curved and constrained surfaces.
Minimizes mass for embedded electronic systems.
Built for application-specific electrical requirements.
Supports integration within space-constrained enclosures.
Wide Voltage Options: Supports 0.6Vpp to 30Vpp operation.
Compact Form: Optimized for space-constrained integration.
Low-Profile: Fits within compact device housings.
Indoor & Outdoor: Operates across varied lighting conditions.
Long-Term Reliability: No moving parts, minimal service.
Integrated Manufacturing: Controlled from design through production.
IoT Developers: Embedding solar directly into sensors and devices.
Product Engineers: Battery-free electronic design.
OEMs: Seeking small-scale solar for consumer or industrial products.
Industrial Designers: Solving space-constrained integration challenges.
System Architects: Developing energy harvesting system designs.
Hardware Developers: Building ultra-low-power electronic platforms.
Thin-film panels designed for general outdoor and mixed-light use.
Balanced output profile: Reliable performance in variable conditions.
Flexible laminate construction: Lightweight and integration-ready.
Custom sizing available: Adaptable to device constraints.
Thin-film panels optimized for indoor and low-illuminance environments.
Low-illuminance optimization: Performs under indoor lighting.
Low-current output profile: Supports sensor and IoT applications.
Compact form factors: Designed for embedded integration.
Thin-film panels engineered for portable and light outdoor exposure.
Lightweight encapsulation: Suitable for occasional outdoor use.
Flexible construction: Simplifies product integration.
Defined performance range: Matched to low-power systems.
Thin-film panels designed for long-term outdoor deployment.
Encapsulated construction: Moisture and debris resistant.
Stable output profile: Designed for continuous exposure environments.
Low-maintenance architecture: No moving parts.
Provide power and integration requirements for review.
Provide power and integration requirements for review.